Scholarship Essay Contest High requirements on the mobile system is currently pushing them beyond simple communication tool, and make them reminiscent of the
terminal global aid that includes entertainment, offices and public services. This means continuous improvement in terms of
of the required computing performance. The ability of technology scaling complementary metal-oxide-semiconductor (CMOS) offers one
possible way to improve system performance. However, it comes with a high cost in terms of fabrication complexity and power
efficiency. Scholarship Essay Contest Another alternative that addresses this barrier consists of vertical electronic chip lurk on top of each other using
vertical connection (Fig. 1) is called through-silicon vias (TSV), thus increasing computing performance, while using the same
system footprint.
Key competencies:
- Knowledge in the field of classical thermal physics
- Understanding the solid-state physics and MOS transistor
- Ability to perform numerical simulation and physical modeling
using a finite element simulator
- Ability to perform electrical testing and characterization and
developing automatic input of data and processing tools
- Basic understanding of CMOS circuits and logic systems
- Ability to design basic logic circuits or the ability to develop these competencies
- It takes team work within the framework of collaborating a lot with the team involved
- Excellent time management skills
- Creativity, self motivation, personal involvement
- Very good academic classes
Scholarship Essay Contest Application Deadline: Contact your employer, haykel.ben-jamaa-at-cea.fr
Details Scholarship Information and Application
Tidak ada komentar:
Posting Komentar